University of Notre Dame
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Different Shapes of the Future: Perovskites and Chalcohalides Semiconductor Nanocrystals

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posted on 2024-07-30, 16:19 authored by Irina Gushchina
The demand for sustainable energy sources has driven extensive research efforts in various directions, unfolding a new era for emerging semiconductor materials. Over the past few decades, semiconductor materials have undergone thorough investigation for their potential applications in diverse devices, starting with solar cells and ending up with TVs. However, before these materials can be commercialized, scientists must address the challenges they encounter. This thesis focuses on novel materials synthesis and characterization, as well as discussing potential applications and strategies for mitigating intrinsic and extrinsic instabilities in semiconductor materials. Specifically, it addresses: 1) Perovskite colloidal nanocrystals which show promise for solar cell and photodetector applications but exhibit instability under sunlight. Proposed solutions include methods to prevent anion segregation. 2) Exploration of a new class of materials known as chalcohalides, where novel materials have been synthesized and characterized for potential application in light-harvesting systems. By touching these areas, the thesis aims to contribute to the advancement of sustainable energy technologies by providing insights into the synthesis, characterization, and application of semiconductor materials.

History

Date Created

2024-07-15

Date Modified

2024-07-30

Defense Date

2024-07-08

CIP Code

  • 40.1001

Research Director(s)

Masaru Kuno Alexander Mukasyan Luca Gavioli Liberato Manna

Committee Members

Prashant Kamat Emily Tsui Diego Colombara Lorenzo Malavasi

Degree

  • Doctor of Philosophy

Degree Level

  • Doctoral Dissertation

Language

  • English

Library Record

006610972

OCLC Number

1450368036

Publisher

University of Notre Dame

Additional Groups

  • Chemistry and Biochemistry

Program Name

  • Chemistry: Materials Science and Engineering

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