Inter-chip Communication

https://doi.org/10.7274/24827841

standard

posted on 2016-06-07, 00:00 authored by Gary H BernsteinGary H Bernstein, Patrick Fay, Qing Liu, Wolfgang Porod

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

History

Related Materials

1.
URL - References http://patft.uspto.gov/netacgi/nph-Parser?Sect2=PTO1&Sect2=HITOFF&p=1&u=/netahtml/PTO/search-bool.html&r=1&f=G&l=50&d=PALL&RefSrch=yes&Query=PN/8623700

Publisher

United States Patent and Trademark Office

Date Modified

2016-06-07

Contributor

Gary H. Bernstein|Patrick Fay|Wolfgang Porod|Qing Liu|

Language

English

Patent Number

US 8623700 B2

Other Application

11/599,283

USPTO Link

http://patft.uspto.gov/netacgi/nph-Parser?Sect2=PTO1&Sect2=HITOFF&p=1&u=/netahtml/PTO/search-bool.html&r=1&f=G&l=50&d=PALL&RefSrch=yes&Query=PN/8623700

Inventor

Gary H. Bernstein Patrick Fay Wolfgang Porod Qing Liu

Inventor from Local Institution

Gary H. Bernstein Patrick Fay Wolfgang Porod Qing Liu

Assignee

University of Notre Dame Du Lac

Claims

19

Cooperative Patent Classification Codes

H01L 23/60 (20130101); H01L 24/06 (20130101); H01L 24/13 (20130101); H01L 24/16 (20130101); H01L 24/24 (20130101); H01L 24/72 (20130101); H01L 24/73 (20130101); H01L 25/0652 (20130101); H01L 25/0655 (20130101); H01L 25/0657 (20130101); H01L 25/16 (20130101); H01L 25/18 (20130101); H01L 29/0657 (20130101); H05K 1/181 (20130101); H05K 1/182 (20130101); H01L 2223/6677 (20130101); H01L 2224/05644 (20130101); H01L 2224/05647 (20130101); H01L 2224/13099 (20130101); H01L 2224/18 (20130101); H01L 2224/48227 (20130101); H01L 2224/49175 (20130101); H01L 2224/81224 (20130101); H01L 2225/0651 (20130101); H01L 2225/06551 (20130101); H01L 2225/06562 (20130101); H01L 2225/06596 (20130101); H01L 2924/01014 (20130101); H01L 2924/01015 (20130101); H01L 2924/01029 (20130101); H01L 2924/01046 (20130101); H01L 2924/01078 (20130101); H01L 2924/01079 (20130101); H01L 2924/01082 (20130101); H01L 2924/014 (20130101); H01L 2924/10156 (20130101); H01L 2924/10253 (20130101); H01L 2924/10271 (20130101); H01L 2924/10329 (20130101); H01L 2924/14 (20130101); H01L 2924/15311 (20130101); H01L 2924/19041 (20130101); H01L 2924/19042 (20130101); H01L 2924/30105 (20130101); H01L 2924/3011 (20130101); H01L 2924/3025 (20130101); H01L 2224/05644 (20130101); H01L 2924/00014 (20130101); H01L 2224/05647 (20130101); H01L 2924/00014 (20130101); H01L 2224/81141 (20130101); H01L 24/48 (20130101); H01L 24/49 (20130101); H05K 3/326 (20130101); H05K 3/328 (20130101); H01L 2924/01005 (20130101); H01L 2924/01006 (20130101); H01L 2924/01019 (20130101); H01L 2924/01023 (20130101); H01L 2924/01033 (20130101); H05K 2201/0314 (20130101); H05K 2201/10454 (20130101); H05K 2201/10909 (20130101); H01L 2224/49175 (20130101); H01L 2224/48227 (20130101); H01L 2924/00 (20130101)

International Patent Classification Codes

H01L 21/50 (20060101); H01L 21/48 (20060101); H01L 21/44 (20060101)

US Patent Classification Codes

438/107; 257/685; 257/723; 257/E23.151; 257/E23.175; 438/110; 438/113; 438/129; 438/462; 438/67;