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  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 9633976 B1

    A quilt packaging system includes a first and second electronic device each comprising a plurality of edge surfaces at least a first edge surface of which comprises one or more interconnect modules disposed thereon. The first edge surface of the second electronic device is positioned contiguous to the first edge surface of the first electronic device, and at least one of the one or more interconnect nodules disposed on the first edge surface of the first electronic device is configured to be …

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