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  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 7612443 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2009-11-03
    Resource Type
    Patent
  • Inventor(s):
    Michael Niemier, Mohammad T. Alam, Gary H. Bernstein, Xiaobo Sharon Hu, Wolfgang Porod
    Patent Number:
    US 8058906 B2
    Description:

    A non-majority magnetic logic gate device for use in constructing compact and power efficient logical magnetic arrays is presented. The non-majority magnetic logic gate device includes a substrate, symmetrically aligned magnetic islands (SAMIs), at least one misaligned magnetic island (MAMI), magnetic field inputs (MFIs), and at least one magnetic field output (MFO). The SAMIs and MAMI are electrically isolated from each other but are magnetically coupled to one another through their respecti…

    Date Issued:
    2011-11-15
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 8021965 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2011-09-20
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 7608919 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2009-10-27
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 8623700 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2014-01-07
    Resource Type
    Patent