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  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 7612443 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2009-11-03
    Record Visibility:
    Public
    Resource Type
    Patent
  • Inventor(s):
    Patrick Fay, Ning Su
    Patent Number:
    US 8592859 B2
    Description:

    Example methods and apparatus for Antimonide-based backward diode millimeter-wave detectors are disclosed. A disclosed example backward diode includes a cathode layer adjacent to a first side of a non-uniform doping profile, and an Antimonide tunnel barrier layer adjacent to a second side of the spacer layer.

    Date Issued:
    2013-11-26
    Record Visibility:
    Public
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 8021965 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2011-09-20
    Record Visibility:
    Public
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 7608919 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2009-10-27
    Record Visibility:
    Public
    Resource Type
    Patent
  • Inventor(s):
    Gary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Liu
    Patent Number:
    US 8623700 B2
    Description:

    The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

    Date Issued:
    2014-01-07
    Record Visibility:
    Public
    Resource Type
    Patent