US7608919.pdf (3.53 MB)

Interconnect packaging systems

standard

posted on 2016-06-07, 00:00 authored by Gary H BernsteinGary H Bernstein, Patrick Fay, Qing Liu, Wolfgang Porod

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

History

Patent Number

US 7608919 B2

Other Application

11/599,257

USPTO Link

http://patft.uspto.gov/netacgi/nph-Parser?Sect2=PTO1&Sect2=HITOFF&p=1&u=/netahtml/PTO/search-bool.html&r=1&f=G&l=50&d=PALL&RefSrch=yes&Query=PN/7608919

Inventor

Gary H. Bernstein Patrick Fay Wolfgang Porod Qing Liu

Inventor from Local Institution

Gary H. Bernstein Patrick Fay Wolfgang Porod Qing Liu

Assignee

University of Notre Dame Du Lac

Date Modified

2017-08-01

Language

English

Claims

6

Publisher

United States Patent and Trademark Office

Cooperative Patent Classification Codes

H01L 21/6835 (20130101); H01L 24/11 (20130101); H01L 25/0652 (20130101); H01L 25/0655 (20130101); H01L 25/50 (20130101); H01L 2924/014 (20130101); H01L 24/81 (20130101); H01L 24/83 (20130101); H01L 2224/11003 (20130101); H01L 2224/13099 (20130101); H01L 2224/16 (20130101); H01L 2224/8121 (20130101); H01L 2224/81815 (20130101); H01L 2224/83851 (20130101); H01L 2924/01029 (20130101); H01L 2924/01054 (20130101); H01L 2924/01078 (20130101); H01L 2924/01079 (20130101); H01L 2924/01082 (20130101); H01L 2924/14 (20130101); H01L 2924/1532 (20130101); H01L 2924/30105 (20130101); H01L 2924/3025 (20130101); H01L 2924/01005 (20130101); H01L 2924/01006 (20130101); H01L 2924/01024 (20130101); H01L 2924/01033 (20130101); H01L 2924/3512 (20130101); H01L 2924/00 (20130101)

Contributor

Gary H. Bernstein|Patrick Fay|Wolfgang Porod|Qing Liu

International Patent Classification Codes

H01L 21/44 (20060101); H01L 23/48 (20060101)

US Patent Classification Codes

438/109; 257/686; 257/723; 257/737; 257/777; 257/780; 257/E23.085; 438/128; 438/613

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Not Assigned

Licence

CC BY 4.0

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