Interconnect packaging systems

Patent

Description

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Attributes

Attribute NameValues
Title
  • Interconnect packaging systems

Patent Number
  • US 7608919 B2

USPTO Link
Inventor
  • Gary H. Bernstein

  • Patrick Fay

  • Wolfgang Porod

  • Qing Liu

Inventor From Local Institution
  • Gary H. Bernstein

  • Patrick Fay

  • Wolfgang Porod

  • Qing Liu

Other Application
  • 11/599,257

Claims
  • 6

Classification (US Patent)
  • 438/109; 257/686; 257/723; 257/737; 257/777; 257/780; 257/E23.085; 438/128; 438/613

Cooperative Patent Classification codes
  • H01L 21/6835 (20130101); H01L 24/11 (20130101); H01L 25/0652 (20130101); H01L 25/0655 (20130101); H01L 25/50 (20130101); H01L 2924/014 (20130101); H01L 24/81 (20130101); H01L 24/83 (20130101); H01L 2224/11003 (20130101); H01L 2224/13099 (20130101); H01L 2224/16 (20130101); H01L 2224/8121 (20130101); H01L 2224/81815 (20130101); H01L 2224/83851 (20130101); H01L 2924/01029 (20130101); H01L 2924/01054 (20130101); H01L 2924/01078 (20130101); H01L 2924/01079 (20130101); H01L 2924/01082 (20130101); H01L 2924/14 (20130101); H01L 2924/1532 (20130101); H01L 2924/30105 (20130101); H01L 2924/3025 (20130101); H01L 2924/01005 (20130101); H01L 2924/01006 (20130101); H01L 2924/01024 (20130101); H01L 2924/01033 (20130101); H01L 2924/3512 (20130101); H01L 2924/00 (20130101)

International Patent Classification codes
  • H01L 21/44 (20060101); H01L 23/48 (20060101)

Language
  • eng

Date Issued
  • 2009-10-27

Publisher
  • United States Patent and Trademark Office

Assignee
  • University of Notre Dame Du Lac

Access Rights Open Access
Content License
Departments and Units

Files

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