APA

Dun, C., Kempf, N., Saeidi-Javash, M., Karthik, C., Richardson, J., Hollar, C., Estrada, D., & Zhang, Y. (2020). Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering. Advanced Science News. https://doi.org/10.1002/adfm.201905796

MLA

Dun, Chaochao et al. “Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering.” 3 Apr. 2020. <https://curate.nd.edu/show/qn59q240z7w>

Chicago

Dun, Chaochao, Nicholas Kempf, Mortaza Saeidi-Javash, Chinathambi Karthik, Joseph Richardson, Courtney Hollar, David Estrada, and Yanliang Zhang. 2020. “Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering.” Advanced Science News. doi:10.1002/adfm.201905796.

Harvard

Dun, C. et al. (2020) “Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering.” Advanced Science News. doi: 10.1002/adfm.201905796.

BibTex

@article{dun_kempf_saeidi-javash_karthik_richardson_hollar_estrada_zhang_2020, title={Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering}, url={https://curate.nd.edu/show/qn59q240z7w}, DOI={10.1002/adfm.201905796}, publisher={Advanced Science News}, author={Dun, Chaochao and Kempf, Nicholas and Saeidi-Javash, Mortaza and Karthik, Chinathambi and Richardson, Joseph and Hollar, Courtney and Estrada, David and Zhang, Yanliang}, year={2020}, month={Apr} }