10050027OCR.pdf (488.54 kB)
Quilt packaging system with mated metal interconnect nodules and voids
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posted on 2019-02-18, 00:00 authored by Anthony Hoffman, Douglas C. Hall, Gary H BernsteinGary H Bernstein, Jason M. Kulick, Scott HowardFirst and second integrated devices each have an optical component and a plurality of interconnect structures disposed one edge thereon. The first edge surface of the second integrated device is positioned contiguous to the first edge surface of the first integrated device. The interconnect structures disposed on the first integrated device are in physical contact with the interconnect structures disposed on the edge surface of the second integrated device so as to provide alignment for conveying at least one signal between the optical components on the first and second integrated devices.
History
Patent Number
US 10050027Other Application
15/448,026Inventor
Douglas C. Hall Anthony Hoffman Scott Howard Jason M. Kulick Gary H. BernsteinInventor from Local Institution
Douglas C. Hall Anthony Hoffman Scott Howard Jason M. Kulick Gary H. BernsteinAssignee
Indiana Integrated Circuits, LLC University of Notre Dame Du LacDate Modified
2019-02-18Language
- English
Claims
8Prior Publication Number
US 2017/0179093 A1Publisher
U.S. Patent and Trademark OfficeCooperative Patent Classification Codes
H01L 25/167 (20130101); H01L 22/12 (20130101); H01L 24/17 (20130101); H01L 24/70 (20130101); G02B 6/423 (20130101); G02B 6/4238 (20130101); G02B 6/4257 (20130101); H01L 2224/175 (20130101); H01L 2224/1718 (20130101)Contributor
Douglas C. Hall|Anthony Hoffman|Scott Howard|Jason M. Kulick|Gary H. BernsteinInternational Patent Classification Codes
H01L 23/00 (20060101); H01L 21/66 (20060101); H01L 25/16 (20060101)Usage metrics
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